"New Technology and Applications at Lucas NovaSensor"
Kirt R. Williams
in Triboloby Issues and Opportunities in MEMS
Editor: Bharat Bhushan
Columbus, Ohio, November 1997
pp. 121-134.

Abstract:

We give a tutorial on two commercial micromachining processes 
used at Lucas NovaSensor, orientation- and doping- dependent etching
and silicon fusion bonding.
Combining these with a relatively new technology, 
deep reactive ion etching (DRIE), 
new or improved microelectromechanical devices can be made,
including accelerometers, thermal actuators, and micro flow channels.
While DRIE is capable of relatively rapidly etching vertical trenches, 
reductions in etch-rate variation with trench width and
increases of etch rate can still be made.