"Novel Interconnection Technologies for Integrated Microfluidic Systems,"
D. Jaeggi, B. L. Gray, N. J. Mourlas, B. P. van Drieenhuizen, 
K. R. Williams, N. I. Maluf, and G. T. A. Kovacs,
Technical Digest of the 1998 IEEE Solid-State Sensor and Actuator Workshop
(Hilton Head '98), pp. 112-115.


Novel Interconnection Technologies for Integrated Microfluidic Systems

Abstract

A new approach to realize silicon-based integrated microfluidic systems is presented.
By using a combination of silicon fusion bonding (SFB) 
and deep reactive ion etching (DRIE), multi-level fluidic "PC boards" are fabricated
and used to integrate microfluidic components into a hybrid system. 
As application examples, we demonstrate a multi-level laminating mixer 
and a multi-level manifold with multiple pressure sensors. 
To interface the microfluidic system to the macroscopic world,
three types of DRIE-fabricated, tight-fitting fluidic couplers 
for standard capillary tubes are described. 
One type of coupler is designed for minimal dead space,
while another type reduces the risk of blocking capillaries with adhesive.
A third design demonstrates for the first time a silicon/plastic coupler
combining the DRIE coupler technology with injection-molded press fittings.